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Baking the Assembled PCB

BAKING DETAILS - Place the completed board(s) in your reflow soldering oven and start the reflow cycle. - Once the cycle is complete and the board(s) have cooled, remove them from the reflow oven for inspection.

AFTER BAKING INSPECTION

• Check the entire PCB for Solder bridges, especially on MCU (U1), U7, U4 and all the Qs
• Examine the new solder joints for dryness, this is normally depicted by dull looking solder, it all should be rather shinny.
• Clear any solder beads that may have formed on the PCB, this can easily be performed by using a tooth brush and giving the PCB a quick and careful scrub.

AFTER BAKING TESTING

Testing MCU for solder bridges

• Set your DMM for measuring resistance 200 ohm range should be OK;
  • Check from one MCU (U1) pin to the next to make sure they are not shorted together.
    • There is one exception, only MCU (U1) pins 85 and 86 should show shorted.
  • Check from one USB UART (U7) pin to the next to make sure they are not shorted together.
    • There is one exception, only USB UART (U7) pins 25 and 26 should show shorted.
  • Check from one MAX9926 (U4) pin to the next to make sure they are not shorted together.
    • There is no exception.
  • Check from one VNN7NV0413TR (Q9-11) pin to the others to make sure they are not shorted together.
    • Also make sure that no pin is shorted to ground.
  • Check from one VND7NV04 (Q1-8) pin to the others to make sure they are not shorted together.
    • Also make sure that no pin is shorted to ground.

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